Huawei Ascend P6,which was released on June 18th ,2013, in London, was the thinnest smart phone ever at that time.P6 is particular and famous not only because of the thinnest AL frame, but also shows bright c chamfer and arc bottom.

Prototype is used to verify phone appearance and structure in the product development stage,since the thickness of decorating frame is only 0.6mm,it didn’t go well when making prototype.After discussion among several technical engineer,we tried sheet metal fabrication in the beginning.However this process resulted in big deviation,and made chamfer out of shape.

The other process we tried was machining separately,the straight part of the frame was placed flatly under the spindle,the curving part was processed in vertical direction. Finally we achieved 0.6mm thickness,but due to different clamping method,the C chamfer was not straight.Another problem was found after anodizing,the decorating frame with uniform chamfer would transform when clamping for anodizing,which is hard for customer to accept.